|
|
Winbond Electronics Corporation
|
IC DRAM 1G PARALLEL 168WFBGA |
7.756 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 9M PARALLEL 119PBGA |
- |
|
Laos |
|
|
Cypress Semiconductor
|
IC SRAM 1M PARALLEL 44SOJ |
- |
|
Laos |
|
|
Maxim Integrated
|
IC EEPROM 1.25K 1WIRE 6TDFN |
- |
|
Laos |
|
|
Micron Technology
|
IC DRAM 576M PARALLEL 144FBGA |
66.284 |
|
Laos |
|
|
Micron Technology
|
IC FLASH 128G MMC 169WFBGA |
20.959 |
|
Laos |
|
|
ROHM Semiconductor
|
|
0.67 |
|
Laos |
|
|
Cypress Semiconductor
|
IC SRAM 9M PARALLEL 172FBGA |
- |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 1.125M PARALLEL 256CABGA |
75.749 |
|
Laos |
|
|
ISSI (Integrated Silicon Solution, Inc.)
|
IC SRAM 18M PARALLEL 165TFBGA |
- |
|
Laos |
|
|
Micron Technology
|
LPDDR3 6G 192MX32 FBGA |
8.386 |
|
Laos |
|
|
Micron Technology
|
IC FLASH 64M PARALLEL 56TSOP |
2.928 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 9M PARALLEL 256CABGA |
176.106 |
|
Laos |
|
|
LAPIS Semiconductor
|
IC EEPROM 32K SPI 20MHZ 8TSSOP |
0.561 |
|
Laos |
|
|
Cypress Semiconductor
|
IC FLASH 256M SPI 80MHZ |
3.941 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 64K PARALLEL 64TQFP |
- |
|
Laos |
|
|
Cypress Semiconductor
|
IC SRAM 16M PARALLEL 56TSOP |
- |
|
Laos |
|
|
LAPIS Semiconductor
|
IC EEPROM 1K I2C 400KHZ 8SOP |
0.129 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 16K SPI 10MHZ 8TSSOP |
0.515 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 2K SPI 2MHZ 8SOIC |
- |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 4K SPI 2MHZ 8SOIC |
0.474 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 256K PARALLEL 100TQFP |
- |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 64K PARALLEL 84PLCC |
- |
|
Laos |
|
|
Cypress Semiconductor
|
IC NVSRAM 64K PARALLEL 28CDIP |
- |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 8K SPI 10MHZ 8MSOP |
0.556 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 128K I2C 400KHZ 8MAP |
- |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 256K PARALLEL 128TQFP |
- |
|
Laos |
|
|
Micron Technology
|
IC FLASH 2M PARALLEL 44SO |
2.634 |
|
Laos |
|
|
Adesto Technologies
|
IC FLASH 4M SPI 66MHZ 8SOIC |
- |
|
Laos |
|
|
Micron Technology
|
IC FLASH 256M PARALLEL 64EASYBGA |
6.598 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 1M PARALLEL 44TSOP II |
- |
|
Laos |
|
|
Micron Technology
|
IC FLASH 512G PARALLEL 333MHZ |
53.323 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC FLASH 1M PARALLEL 32DIP |
- |
|
Laos |
|
|
Adesto Technologies
|
IC FLASH 256K SPI 104MHZ 8TSSOP |
0.358 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 1K SPI 3MHZ 8TSSOP |
0.268 |
|
Laos |
|
|
Micron Technology
|
IC DRAM 128M PARALLEL 90VFBGA |
9.823 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 16K SINGLE WIRE 8SOIC |
0.299 |
|
Laos |
|
|
Cypress Semiconductor
|
|
10.175 |
|
Laos |
|
|
Viking Technology
|
IC DRAM 4G PARALLEL 1.2GHZ |
399.266 |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 512K PARALLEL 100TQFP |
- |
|
Laos |
|
|
Toshiba Memory America, Inc.
|
IC FLASH 256G MMC 153WFBGA |
- |
|
Laos |
|
|
Micron Technology
|
IC FLASH 16M PARALLEL 48TSOP |
2.139 |
|
Laos |
|
|
Micron Technology
|
IC DRAM 2G PARALLEL 96FBGA |
5.785 |
|
Laos |
|
|
Micron Technology
|
IC DRAM 32G 2133MHZ FBGA |
118.95 |
|
Laos |
|
|
ISSI (Integrated Silicon Solution, Inc.)
|
IC DRAM 8G PARALLEL 96LFBGA |
26.619 |
|
Laos |
|
|
Micrel / Microchip Technology
|
IC EEPROM 4K I2C 400KHZ 8DIP |
0.288 |
|
Laos |
|
|
Cypress Semiconductor
|
IC NOR |
1.849 |
|
Laos |
|
|
Winbond Electronics Corporation
|
IC FLASH 4M SPI 80MHZ 8SOIC |
- |
|
Laos |
|
|
IDT (Integrated Device Technology)
|
IC SRAM 256K PARALLEL 68PLCC |
- |
|
Laos |
|
|
ISSI (Integrated Silicon Solution, Inc.)
|
IC DRAM 1G PARALLEL 84WBGA |
11.32 |
|
Laos |
